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JPS63243272A Expired / Lapsed JP ⏱️ 0.0 years remaining

Magnetron sputtering method

Assignee: Sumitomo Light Metal Industries Ltd
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Filing: 1987-03-31
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Granted: —
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Expires: 2007-03-31
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Abstract

Abstract PURPOSE:To increase the efficiency of utilization of a target by placing a magnet on the rear side of the target in the radial direction of a substrate, rotating the magnet and conically protruding the central part of the target. CONSTITUTION:A magnet 4 is placed on a turntable 20 on the rear side of a target 2 and the outside of a sputtering chamber 6 in the radial direction of a circular substrate 12. The central part of the target 2 is conically protruded 2a. The magnet 4 is rotated on the center of the target 2 as the center of rotation to rotate a sputtering region extending in the radial direction of the target 2 around the center of the target 2. Atoms sputtered from the target 2 by electric discharge are deposited in the circumferential direction of the substrate 12. Though the central part of the target 2 is violently consumed, the conically protruded shape compensates the consumption and the efficiency of utilization of the target 2 is increased.

Inventors

  • 👤 Makoto Ando
  • 👤 誠 安藤
  • 👤 Takao Soubu
  • 👤 相武 隆男

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-08 18:06
CPC Classifications
—

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