Multichip module for microcomputer

Abstract

Abstract PURPOSE:To improve packaging density, while maintaining compatibility changeability and attaching/detaching facilities, by loading in parallel plural single chip microcomputer chips so as to share a lead pin on a substrate on which plural lead pins are provided in accordance with a standard of a dual in-line package. CONSTITUTION:The titled module is constituted by loading in parallel plural single chip microcomputer MPU1-MPU3 chips loaded on a chip carrier, and also, incorporating at least a program memory, so as to share a lead pin LP, on a substrate BP on which plural lead pins LP are provided in accordance with the standard of the duel in-line package. In such a way, since on the same space as one single chip microcomputer MPU1, plural chips of the same single chip microcomputers MPU2, MPU3 as said computer are loaded, the compatibility and the attaching/detaching facilities being advantages of the dual in-line package can be maintained from a relation of the lead pin LP to the substrate BP, and also, the packaging density is improved.

Inventors

• 👤 Takashi Takizawa
• 👤 滝沢　隆

Bibliographic Details