Method and apparatus for coating resist

Abstract

Abstract PURPOSE:To prevent an irregular film thickness and an irregular coating from occurring due to the influence of an air stream by coating a substrate to be treated with resist by a chamber having air stream alleviating means. CONSTITUTION:A semiconductor wafer 14 is placed at a predetermined position on a chuck 15 provided in a cup 13, and, for example, attracted and held. Then, a supply nozzle 17 is moved on the central axis of the wafer 14, resist is fed out on the steadily remaining wafer 14, and moved out of above the cup 13. Then, a chamber 11 having a mesh 12 of air stream alleviating means moves down by an elevator mechanism 10 to be connected to the cup 13 in a hermetically sealing manner, exhausting is started through an exhaust tube 19 by an exhausting mechanism 18, the wafer 14 is rotated at a high speed to diffuse the resist. The turbulence of the air stream generated by the influence of the high speed rotation of the wafer 14 or the chuck 15 at this time is alleviated by the mesh 12. Thus, the film thickness of the resist can be uniformized.

Inventors

• 👤 Tsutae Omori
• 👤 伝 大森
• 👤 Takehiko Orii
• 👤 折井　武彦

Bibliographic Details