Tape sticking equipment for semiconductor wafer

Abstract

Abstract PURPOSE:To prevent the damage on a surface by forming a supporter which attracts and holds a semiconductor wafer in the periphery and a pressurizer which pressurizes the inner surface of the semiconductor wafer in a noncontact state on a wafer susceptor on which the semiconductor wafer is mounted with the surface facing down. CONSTITUTION:A semiconductor wafer 2 mounted on a wafer susceptor 7 with the surface facing down makes a contact with a supporter 8 only in the periphery of the wafer and is held on the supporter 8 by attracting the semiconductor wafer 2 with a hole 9 for attracting. Then, air is ejected from a nozzle 10 and the inside of a pressurizer 11 is made a pressurized state. In such a state, when an adhesive tape 5 is stuck by the horizontal movement of an adhesive roller 6, the adhesive tape 5 is stuck from the upheaved center of the semiconductor wafer 2 toward the periphery. As a result, the air between the semiconductor wafer 2 and the adhesive tape 5 is smoothly exhausted from the center of the wafer toward the periphery. This can reduce the damage on the semiconductor wafer and the entrainment of bubbles.

Inventors

• 👤 Ichiro Hayashi
• 👤 一郎 林
• 👤 Morikazu Tatsumi
• 👤 辰巳　守一
• 👤 Toshio Takeuchi
• 👤 竹内　利夫

Bibliographic Details