Sputtering apparatus

Abstract

Abstract PURPOSE:To improve uniform coverage of the step shaped substrate by sputtering, by perpendicularly placing a substrate supporting jig at the outside of the principal surface of a flat plate-shaped target, by enabling the jig to freely rotate and by depositing particles generated by sputtering on a substrate at an angle. CONSTITUTION:A substrate supporting jig 3 is rotatably placed at the outside of the principal surface of a flat plate-shaped target 1 and at a position away from the principal surface in the sputtering direction so that the principal surface of the target 1 meets at right angles to a normal line of the principal surface of a substrate 2 on which a film is formed by sputtering. Many particles 4 generated by sputtering are deposited on the principal surface of the substrate 2 at an angle and a film having satisfactory step coverage is obtd.

Inventors

• 👤 Yoshitake Ishihara
• 👤 石原　良剛

Bibliographic Details