Semiconductor device

Abstract

Abstract PURPOSE:To securely deposit an element-mounting material on a substrate by an easy and short-time operation using a heat-welding method, an ultrasonic bonding method or the like for easily realizing an automatic operation and to form a thin semiconductor device in such a way that the element-mounting material is composed of a thermoplastic resin material which can be deposited on the substrate. CONSTITUTION:A semiconductor device is composed of an insulating substrate 1 which has a through hole 12 and a wiring pattern 13, a sheet-like element-mounting material 16 which is fixed to one face of the substrate and blockades the through hole, a semiconductor element 17 which is fixed to the element-mounting material inside the through hole and is connected to the wiring pattern, and a sealing material 19 which seals the semiconductor element inside the through hole. At this semiconductor device, a film-like element-mounting material 16 which is composed of a thermo-plastic resin material such as polyphenylene sulfide or the like and whose thickness is about 50 mum is mounted in a prescribed position at the through hole 12 on an inverted substrate 11. Then, while the contact surface between the element-mounting material 16 and the substrate is pressurized, it is heated at about 300-350 deg.C for several seconds; the contact surface of the element-mounting material 16 is melted and deposited on the substrate 11.

Inventors

• 👤 Yutaka Okuaki
• 👤 奥秋　裕

Bibliographic Details