Semiconductor device

Abstract

Abstract PURPOSE:To increase the number of the external lead wires into twofold than ever and to increase the number of connects of a semiconductor element with other electronic apparatus into twofold by a method wherein the integrally formed external lead wires are respectively mounted at the same position by superposing in such a way as to hold one insulator between them. CONSTITUTION:Insulators 5 are respectively adhered with external lead wires 3 and 6 with a bonding agent and so forth. The external lead wires 3 and 6 formed integrally with the insulators 5 are respectively mounted on a substrate 2 at a constant interval, hereby when the substrate 2 has the same size as that of the substrate of an external electronic apparatus, the number of the external lead wires is increased into twofold and the number of connecting wires with the external electronic apparatus is increased into twofold. By this constitution, a semiconductor element having numerous external interfaces is contrived so as to be made and a semiconductor device, which needs hitherto two pieces of the semiconductor elements, can be done with one piece of the semiconductor element. As a result, this invention is effective in miniaturizing the device, and moreover in manufacturing this device at low price.

Inventors

• 👤 Akira Takahashi
• 👤 章 高橋

Bibliographic Details