Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To facilitate the junction remarkably by a method wherein the electrodes of the first semiconductor element are junctioned to the electrodes of the second semiconductor element through the intermediary of metallic protrusions. CONSTITUTION:A substrate 11 and a semiconductor element 13 are positioned so that the metallic protrusions 12 on the substrate 11 may be opposed to the electrodes 15 of semiconductor element 13 for making them abut against with one another to be pressurized and heated. By this pressurization and heating processes, the metallic protrusions 12 on the substrate 11 can be transferred and junctioned to the electrodes 15 of semiconductor element 13. At this time, the metallic protrusions 12 made of Au and the electrodes 15 made of Al are junctioned by a bit of Au.Al alloy. Finally the semiconductor element 13 and another semiconductor element 14 are positioned so that the metallic protrusions 12 junctioned to the electrodes 15 of semiconductor element 13 and the other electrodes 16 of semiconductor element 14 may be opposed to one another for making them abut against with one another to be pressurized and heated.

Inventors

• 👤 Kenzo Hatada
• 👤 畑田　賢造

Bibliographic Details