Plastic sealed solid state image sensor

Abstract

Abstract PURPOSE:To form a solid state image sensor at a low cost, by using a sealing method of a plastic sealed structure in sealing the solid state image sensor. CONSTITUTION:On an epoxy substrate 1, a lead frame 2 comprising aluminum clad iron is bonded with an epoxy bonding agent 3. A solid state image sensor chip 5 is bonded to a part of the lead frame with an epoxy conductivity type bonding agent 4. Aluminum wire 6 is bonded with ultrasonic waves for wiring the chip 5 and the lead frame 2. A cap 7 comprising an epoxy material is further bonded to the surfaces of the epoxy substrate 1 and the lead frame 2 with the epoxy bonding agent 3. A transparent window 8 comprising glass, acrylic material, hard coated plastic or the like is bonded to the surface of the epoxy cap 7 with the bonding agent 3 such as the epoxy bonding agent.

Inventors

• 👤 Seiichi Iwamatsu
• 👤 誠一 岩松

Bibliographic Details