Patent JPS6286737A successfully refreshed from Google Patents.
JPS6286737A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Substrate for face down bonding
Assignee: Seiko Epson Corp
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Filing: 1985-10-11
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Granted: —
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Expires: 2005-10-11
Abstract
Abstract PURPOSE:To enable the freedom of pattern arrangement to augment on a substrate for face down bonding by perforating a plurality of mold filling holes in the substrate. CONSTITUTION:Mold filling holes 3 are perforated at plurality of places, for example, at two places, in a substrate 1. Hereby, patterns 2 can be arranged on the central part of the substrate. By perforating a plurality of mold filling holes in such a way, the freedom of pattern arrangement can be augmented on the substrate.
Inventors
- 👤 Kiyoyuki Shibata
- 👤 柴田 清幸
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-03 17:38
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/012; H10W74/00; H10W74/10; H10W74/15
Claims Analysis
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