Package integral with radiator fin

Abstract

Abstract PURPOSE:To enable an IC package of excellent heat radiation to be obtained without increasing the effective volume and without using a high-quality material by alternately forming a plurality of groove stripes and projected stripes on both or one of the upper and lower surfaces. CONSTITUTION:On the upper and lower surfaces of a package 1, a plurality of groove stripes 3 and projected stripes 4 are alternately provided, and the depth of the groove stripes (the height of the projected stripes) and the number thereof are arbitrary. Since the surface area of the package is increased in this way, the heat radiation effect is enhanced. The projected stripes 4 can be considered to be radiator fins, since the heat is radiated from this surface. And since the groove stripes 3 and projected stripes 4 increase, the shape becomes complicated, but the manufacture process itself does not become complicated.

Inventors

• 👤 Takashi Kaneko
• 👤 兼子　隆

Bibliographic Details