Package for integrated circuit

Abstract

Abstract PURPOSE:To reduce the size by forming an inverted L-shaped sectional auxiliary conductive land base on a base, and forming upper and lower conductive lands on the base and the land base. CONSTITUTION:After a conductive land 3 on a package base 1 is connected with an electrode of the outer peripheral side on an integrated circuit secured to the central recess by fine metal wirings 4, a conductive land 6 on an inverted L-shaped sectional auxiliary conductive land base 5 is connected with the lead conductive passage 6a of the land, the base 5 is placed on a base 2, and high temperature is applied to secure both. Then, the land 6 on the base 5 is connected with the inner peripheral side on an integrated circuit element corresponding to the land 6 by fine metal wirings 7. Thus, the connection of electrodes formed in double on the periphery of the integrated circuit element becomes the shortest distance. Even if the electrodes and the leads are increased, the number of the leads can be increased without increasing the area of the package.

Inventors

• 👤 Koichi Hirose
• 👤 幸一 廣瀬

Bibliographic Details