Method of cooling semiconductor component

Abstract

Abstract PURPOSE:To improve the cooling effect, by transferring heat generated in each semiconductor component through a heat pipe having a high heat conductivity to a collective heat-dissipating body having a larger heat-dissipating area so that the heat is dissipated therefrom. CONSTITUTION:An adapter 18 formed of an aluminium plate is removably secured to a cooling heat-dissipation body 7 of a semiconductor component 6. One end of a heat pipe 20 is placed in a semicircular groove formed in the adapter 18 and a presser plate 19 is disposed thereon such that the pipe end is interposed between the adapter and the plate. The other end of the heat pipe 20 is fixed to a collective heat-dissipation body 21 attached on a side face of a substrate 2, by means of a connection block 22. Heat generated in the semiconductor component 6 is transmitted through the cooling heat- dissipation body 7, the adapter 18 and the heat pipe 20 to the larger collective heat-dissipation body 21, from which it is dissipated to the outside.

Inventors

• 👤 Masayoshi Watanabe
• 👤 渡辺　正義
• 👤 Shigeru Sakai
• 👤 坂井　茂
• 👤 Yoshiyuki Nakayama
• 👤 中山　義幸

Bibliographic Details