Semiconductor wafer supporting boat

Abstract

Abstract PURPOSE:To obtain a boat with a light weight and a small heat capacity by a method wherein a boat main part is formed into a thin plate shape and protruded stripes are formed on the inside surface of the boat main part in parallel and to the longitudinal direction of the main part. CONSTITUTION:A boat main part 1 is formed to have a thin plate shape and four protruded stripes 2 are formed on the inside surface of the boat main part 1 in parallel and to the longitudinal direction of the main part 1. The protruded stripes 2 and the main part 1 are formed solidly with the material whose main component is SiC. Predetermined number of grooves 3 are formed on the protruded stripes 2 and wafers 4 are supported by placing them in those grooves 3. As the wafers 4 are supported by the protruded stripes 2, contact area between the boat and the wafer 4 is small. Therefore, damages given to the wafer 4 is reduced.

Inventors

• 👤 Takashi Tanaka
• 👤 隆 田中
• 👤 Masahiro Yamaguchi
• 👤 昌宏 山口

Bibliographic Details