Semiconductor device

Abstract

Abstract PURPOSE:To shorten a wire for connecting a specific external lead in a DIP, on one side thereof an odd numbered external leads are arranged, by displacing a middle external lead in the external leads from the center line in the longitudinal direction of a die stage. CONSTITUTION:A middle external lead 12a in an odd number of external leads 12 is positioned at the center of a package, and a center line C in the longitudinal direction of a die stage 15 is displaced and disposed from the center L of the package. Consequently, the middle external lead 12a in the external leads 12 is displaced from the center line C, thus making the length of a wire connecting the external lead 12a and a pad 19a the same as other wires. Accordingly, the wire is not made to flow and is not brought into contact with other wires.

Inventors

• 👤 Tsuyoshi Aoki
• 👤 強 青木
• 👤 Osamu Inoue
• 👤 修 井上

Bibliographic Details