Semiconductor device

Abstract

Abstract PURPOSE:To reduce a chip size by extending the inner ends of power leads disposed on a diagonal line of a package to the center of a semiconductor element to enable providing a power terminal adjacently to a peripheral circuit provided at the center of the element. CONSTITUTION:Leads 31 connected with terminals of a semiconductor element (pads such as power pads Pvcc) are formed of inner leads 311 extended into a package 5 formed by plastic molding and outer leads 312 extended out of the package 5, and the ends of the leads 311 and the terminals of the element are connected by fine metal wirings (bonding wirings) 33. Thus, it is not necessary to wire power wirings connected with a peripheral circuit region 13 from power pads Pvcc, Pvss along cell array regions 11, 12 at all to largely reduce a chip size (specially chip width), thereby preventing the package from increasing to the maximum limit upon increasing of the capacity of a semiconductor element.

Inventors

• 👤 Kimiaki Sato
• 👤 公昭 佐藤
• 👤 Yoshihiro Takemae
• 👤 義博 竹前
• 👤 Masao Nakano
• 👤 正夫 中野
• 👤 Osami Kodama
• 👤 小玉　修巳

Bibliographic Details