Wafer polishing device

Abstract

Abstract PURPOSE:To enable the manufacture of a flat surface wafer without any distortion by providing a means wherein the larger a clearance is between the wafer and a polishing plate in a direction off the polishing plate, the smaller a force tends to be on a support plate. CONSTITUTION:With a clearance 8 formed between a wafer 1 dipped in a grinding liquid 11 and a polishing plate 7, the wafer 1 and the polishing plate 7 are made to have relative motion. Then, the polishing liquid 11 starts to flow at the clearance 8 between the wafer 1 and the polishing plate 7 and the more said relative motion is, the less the pressure is at the clearance 8. Consequently, a wafer supporting plate 2 held by grinders 5 and 6 are attracted toward the polishing plate 7 to such an extent that the clearances 8 becomes fine. In this case, a concave 10 formed on the polishing plate 7 works to help lowering the pressure by making an eddy in the fluid current. When grains contained in the polishing liquid 11 passes the clearance 8 at a high speed, they chafe, process in an atomic order accuracy and polish without any distortion, the wafer 1 respectively.

Inventors

• 👤 Tsuneo Hamaguchi
• 👤 恒夫 濱口

Bibliographic Details