Chip carrier for electronic element

Abstract

Abstract PURPOSE:To suppress the heat generation of an electronic component chip and to contrive to improve its reliability by a method wherein the electronic component chip is mounted on the surface of a printed-wiring board at the fixed position of the metal bar of the printed-wiring board, and at the same time, one end part of the metal bar is provided with a heat-radiating part. CONSTITUTION:A hole 3 for holding a metal bar is penetrated in a printed- wiring board 1 which is formed by providing circuit patterns 4 on the surface of a substrate 2 and the base part of the metal bar 17 is inserted and fixed in the hole 3 for holding the metal bar. One end part of the metal bar 17 is protruded from the surface of the printed-wiring board 1, an electronic component chip 5 is mounted on the surface of the printed-wiring board 1 at the fixed position of the metal bar 17, and at the same time, the other protruded end part of the metal bar 17 is provided with a heat-radiating part 6. By this constitution, the heat of the electronic component chip 5 is radiated through the heat-radiating part 6 along the metal bar 17.

Inventors

• 👤 Toru Higuchi
• 👤 徹 樋口
• 👤 Toshiyuki Yamaguchi
• 👤 敏行 山口
• 👤 Takeshi Kano
• 👤 武司 加納

Bibliographic Details