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JPS6237952A Expired / Lapsed JP ⏱️ 0.0 years remaining

Semiconductor device

Assignee: Panasonic Holdings Corp
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Filing: 1985-08-12
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Granted: —
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Expires: 2005-08-12
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Abstract

Abstract PURPOSE:To improve high frequency characteristics, by using a circular or elliptical package, in which five or more terminals are arranged in a radial pattern. CONSTITUTION:A lead 5 is provided between a terminal 1 and a terminal 2. A lead 6 is provided between a terminal 3 and a terminal 4. In this package, the length from a chip fixing part 31 to terminals 32-36, which are to be wire- bonded, becomes almost equal to the length from the end of a plastic sealing part to the end of the lead. The length becomes considerably small, as 1-1.5mm. Therefore, high frequency characteristics can be improved.

Inventors

  • 👤 Shutaro Nanbu
  • 👤 修太郎 南部
  • 👤 Tadashi Tanida
  • 👤 谷田 忠
  • 👤 Kaoru Muramatsu
  • 👤 村松 薫

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-10-30 11:18
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W44/00; H10W44/20

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