Semiconductor integrated circuit device

Abstract

Abstract PURPOSE:To prevent cracks from occurring by thermal shock in a package, by putting a specific resinous layer between a metal tab, on which a semiconductor is mounted, and sealing resin. CONSTITUTION:A resinous layer 11 having thermal stability, plasticity sufficiently larger than that of sealing resin 1, and adhesiveness to both metal and resin, is put in a plane shape between a metal tab 2 and the sealing resin 1. For example, epoxy resin is used as the sealing resin 1 for forming package of a semiconductor integrated circuit device IC, and polyimido resin being used as resin for the resinous layer 11. Therefore, even if transient heat during soldering enlarges thermal expansion difference between the sealing resin 1 and metal tab 2, the expansion difference is absorbed by plastic deformation of the resin layer 11. Hence, the thermal expansion distortion between the sealing resin 1 and the metal tab 2 can be reduced, so that cracks are prevented from occurring.

Inventors

• 👤 Tomio Yamada
• 👤 富男 山田

Bibliographic Details