Semiconductor device

Abstract

Abstract PURPOSE:To attain the sure measurement of semiconductor chips by providing the inspection pads which the probes for a sensor of a probe card are brought in contact with and the conductors which said pads are connected to, in the peripheral part of the semiconductor chip. CONSTITUTION:On the dicing run 12 extending longitudinally on a substrate 11, the inspection pads 14a, 14b, 14c, and 14d are arranged, which the probes for a sensor of a probe card are brought in contact with. Conductors 15 and 16 are arranged between the pads 14a and 14b, and between the pads 14c and 14d, respectively. A voltage is applied between the probes 17 and 18 for a sensor of the probe card in advance and when the probes 17 and 18 are brought in contact with the pads 14a and 14b respectively, a current flows. Even if one probe is not in contact with the pad, a current does not flow and the function of the sensor can be effected. Accordingly, the measurement of semiconductor chips can be made surely.

Inventors

• 👤 Katsuhiko Sato
• 👤 勝彦 佐藤

Bibliographic Details