Semiconductor device

Abstract

Abstract PURPOSE:To realize the steady soldering by helping the increase of temperature of the external leads by providing a heat radiation absorbing layer on a surface of the external leads, which has a high heat radiation absorbing rate for the heat radiation such as infrared rays and has a high heat conductivity. CONSTITUTION:On an external lead 2, a heat radiation absorbing layer 3 is arranged, whose heat radiation absorbing rate for the heat radiation such as infrared rays and heat conductivity are both high. Then, the absorbing layer 3 absorbs the heat radiation and conducts the heat to the inside of the lead 2. Accordingly, an increase of temperature of the lead 2 is helped and the steady soldering becomes possible.

Inventors

• 👤 Toshio Noda
• 👤 野田　利雄

Bibliographic Details