Semiconductor device

Abstract

Abstract PURPOSE:To microminiaturize a pattern by forming a plurality of bumps on the periphery and the interior of a chip, obtaining a distance between bumps capable of connecting with a conductor pattern on a thin insulating plate and forming on a thin polyimide plate a pattern except the bump connector and external connector. CONSTITUTION:A semiconductor chip 1 has a plurality of bumps, which are formed of bumps 2a existing on the periphery and bumps 2b existing in the interior. A bump connector hole 4 and an external connector hole 5 of a thin plate 3 of polyimide (insulator) are punched in advance, a copper foil is contacted closely on the plate 3, and the prescribed pattern 6 is then formed. In other words, an insulating circuit board having the gold-plated pattern exposed in the holes 4, 5 on the plate 3 is formed. The pattern projected to the hole of the thin plate and a plurality of bumps 2a, 2b on the chip are positioned at 1:1 and connected.

Inventors

• 👤 Yoshimasa Hiki
• 👤 比企　能正

Bibliographic Details