Semiconductor device

Abstract

Abstract PURPOSE:To eliminate the need for increasing the area of a wiring substrate even when the number of LSI chips loaded for enlarging a functional scald must be increaseel by arranging a plurality of semiconductor chips at angles where the main surfaces of the semiconductor chips cross with the main surface of the wiring substrate. CONSTITUTION:A plurality of semiconductor chips 11 in which active functions consisting of P-N junctions are formed in the quadrilateral main surfaces of the chips 11 and external electrodes for extracting the functions to the outside are concentrated and disposed at the ends of one sides of the quadrilateral main surfaces are arranged onto a wiring substrate 12, a main surface of which has electrodes corresponding to the external electrodes for the semiconductor chips 11, wirings connected to the electrodes and mutually connecting and compounding the active functions of the semiconductor chips 11, and external electrodes extracting the compounded functions to the outside, at angles where the main surfaces of the chips cross with the main surface of the wiring substrate 12. The wiring substrate 12 is connected and fixed to an insulating substrate 14 having electrodes corresponding to the external electrodes for the wiring substrate 12 and external electrodes 16 extracting functions connected to the electrodes and compounded to the outside and protecting the semiconductor chips 11 and the wiring substrate 12 electrically and mechanically.

Inventors

• 👤 Miyoshi Yoshida
• 👤 吉田　美義

Bibliographic Details