Thin film forming device
Abstract
Abstract PURPOSE:To make the titled device small in size to one half or thereabout by a method wherein, in a microwave plasma deposition device, two sets of electrodes are positioned opposing to each other so that an electric field vertical to a magnetic field is generated in a vacuum chamber. CONSTITUTION:The titled device is formed with a vacuum chamber 1 in which a chemical vapor-deposition method is performed, a discharge tube 2 wherein a microwave discharge is performed, a coil 3 to be used to apply a magnetic field in the discharge tube 2, a waveguide 7 with which microwaves are introduced, and a microwave generating device 8. At that time, a substrate stand 9 whereon a substrate 10 is placed is provided in the vacuum chamber 1, and an electrode 4 with which an electric field is applied between the substrate stand 9 and the discharge tube 2. Then, discharge gas and reaction gas are introduced from a part tocated between the discharge tube 2 and the vacuum chamber 1 passing through a discharge gas introducing hole 6 and a reaction gas introducing hole 5, and they are jetted out into the discharge tube 2 and the vacuum chamber 1 from the inside shower. As a result, the titled device can be made small in size to one half or thereabout.
Inventors
- 👤 Masahiro Tanaka
- 👤 政博 田中
- 👤 Juichi Shimada
- 👤 嶋田 寿一
- 👤 Shinichi Matsumura
- 👤 松村 信一
- 👤 Takeshi Watanabe
- 👤 渡辺 猛志
- 👤 Mitsuo Nakatani
- 👤 中谷 光雄
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.