Patent JPS6199643A successfully refreshed from Google Patents.
JPS6199643A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Copper alloy for lead frame
Assignee: Proterial Ltd
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Filing: 1984-10-19
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Granted: —
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Expires: 2004-10-19
Abstract
Abstract PURPOSE:To obtain a copper alloy for a lead frame having improved adhesion to mold resin, by incorporating trace amounts of Si and/or Mn to a Cr-contg. copper alloy. CONSTITUTION:A copper alloy for a lead frame has a composition consisting of, by weight, any one of the following and the balance Cu with inevitable impurities: 0.1-1% Cr; 0.1-1% Cr, 0.5-2.5% Sn; 0.1-1% Cr, 0.0005-0.5% Fe and/or 0.001-0.05% Pb; 0.1-1% Cr, 0.5-2.5% Sn, 0.005-0.5% Fe and/or 0.001-0.05% Pb. Si and/or Mn is incorporated to this alloy by 0.001-0.1%.
Inventors
- 👤 Daiji Sakamoto
- 👤 坂本 大司
- 👤 Rikizo Watanabe
- 👤 力蔵 渡辺
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-05 09:37
CPC Classifications
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