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JPS6187748A Expired / Lapsed JP ⏱️ 0.0 years remaining

Heat-stable methacrylic resin composition

Assignee: Kyowa Gas Chemical Industry Co Ltd
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Filing: 1984-10-05
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Granted: —
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Expires: 2004-10-05
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Abstract

Abstract PURPOSE:The titled composition which is excellent in heat stability and can give easily a complicated large molding by molding at high temperature, prepared by adding a small amount of a dithiol compound to a methacrylic resin. CONSTITUTION:The titled composition prepared by adding 0.001-0.5pt.wt. dithiol compound (B) (e.g., glycol dimercaptoacetate) to 100pts.wt. methacrylic resin (A) obtained by polymerizing a mixture comprising 50-100wt% methyl methacrylate (a) and 50-0wt% other copolymerizable vinyl monomers (b) (e.g., methacrylates other than (a), maleic anhydride or styrene). Because this composition can form a resin which is excellent in heat resistance and emits no sensible foreign odor, it is possible to obtain stably and easily a complicated large molding by molding at a higher temperature without risk of coloration and of formation of defects such as silver streaks by thermal decomposition of resin A.

Inventors

  • 👤 Teruo Hasegawa
  • 👤 長谷川 輝夫
  • 👤 Koji Arakawa
  • 👤 荒川 興二

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-02 19:58
CPC Classifications
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