Package for multi-chip

Abstract

Abstract PURPOSE:To change wirings for a hybrid IC easily by forming a bonding pad for altering connections conducted with a buried wiring on the inside of a seal ring pattern on a substrate. CONSTITUTION:A chip part is fixed onto a die pad 15 shaped onto the surface of a ceramic multilayer substrate 10. A seal ring pattern 18 is formed onto the substrate 10, and the lower end of a metallic cap 19 is connected hermetically to the pattern 18. A buried wiring 11 is connected to a bonding pad 21 for changing connections disposed onto the substrate 10 through a branching wiring 20 shaped at a position on the side inner than the pattern 18. When the connection of a bonding wire 26 between a part such as one 17 and a bonding pad such as one 25 must be changed to the pad 21 side in a multi-chip package constituted in this manner, the connection of the wire 26 on the pad 25 side may be altered to the pad 21 side.

Inventors

• 👤 Yoshitaka Fukuoka
• 👤 義孝 福岡

Bibliographic Details