Semiconductor device

Abstract

Abstract PURPOSE:To transmit the heat of semiconductor chips to a cooling part efficiently by a method wherein an elastomer made of fabric cotton with excellent thermal conductivity is laid between the cooling part and a part or all part of junction part of semiconductor device. CONSTITUTION:Semiconductor chips 2 are provided on specified part of a loading substrate 1 through the intermediary of a bump electrode 3 and ten a cooling part 5 is provided on the surface of substrate 1 through the intermediary of adhesive 6. At this time, an elastomer made of conductive fabric cotton such as metallic yarn bundled into metallic cotton at random may be laid between junction part of the base 11 of cooling pat 5 and the semiconductor chips 2.

Inventors

• 👤 Hiroyuki Mizumoto
• 👤 裕之 水本
• 👤 Mitsuo Usami
• 👤 光雄 宇佐美

Bibliographic Details