Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To improve an adhesion between a resist film and a substrate and to reduce a cooling time by cooling down a substrate in which the surface of a resist film is coated with spraying an inert gas in completing of prebaking and postbaking. CONSTITUTION:After a resist coated substrate 4 is arranged on a hot plate 3 and given a determinated heat treatment, the substrate is cooled down quite rapidly by opening a vacuum chuck 5, pressing up the substrate 4 about 1cm with strokes 6 and 6' and injecting a nitrized gas from a nozzle 8 of an injection equipment. According to this, an exposure and a development of a resist film are properly done and a fine patterning is also done.

Inventors

• 👤 Junichi Kai
• 👤 甲斐　潤一
• 👤 Kenji Sugishima
• 👤 賢次 杉島
• 👤 Haruo Tsuchikawa
• 👤 土川　春穂

Bibliographic Details