Semiconductor device

Abstract

Abstract PURPOSE:To enlarge the form of a chip in a package as a lower layer by shaping a pin to a soldering pad section for a package and forming a hole to a pad section for the lower-layer package. CONSTITUTION:Preparatory solder 18 is attached into a hole 14a in a lower- layer package 13, and a corresponding pin 12a in an upper-layer package 11 is inserted and conneced through a reflow. A glass material 21 is affixed to sections except holes 14 and hermetically sealed, and a chip 17 in the package 13 is sealed by the lower surface of the package 11. An interior-finish pattern 19 is connected to each hole 14 through preparatory solder 18, and connected to several element in the chip through leads 20. A chip 17 having the same shape as the chip 17 is housed in the package 11, and sealed by a cover 15. According to said constitution, the size of the chips in the packages as upper and lower layers can be made the same, and a cap exclusive for the lower-layer package can be omitted.

Inventors

• 👤 Teruyuki Nabeta
• 👤 鍋田　照行
• 👤 Tetsushi Wakabayashi
• 👤 哲史 若林

Bibliographic Details