Laminated semiconductor device

Abstract

Abstract PURPOSE:To reduce the mounting space of a laminated semiconductor device by interposing lead wires securing semiconductor pellets between a lower cap and a spacer and between the spacer and an upper cap and packaging them. CONSTITUTION:The lower cap 12 is formed of a flat plate, the upper cap 13 and the spacer 14 have recesses 13a and 14a respectively on the lower surfaces thereof, and are formed on ceramic. The lead wire 6 securing the pellet 4 is interposed between the lower cap 12 and the spacer 14, and the lead wire 5 securing the pellet 3 is interposed between the spacer 14 and the upper cap 13, and the lead wires 5, 6 are sealed with glass 15. According to this configuration, the plane space can be reduced, and the height can also be reduced as compared with a simple lamination. In addition, the manufacturing work can be simple in the same manner as the conventional one.

Inventors

• 👤 Yuji Sano
• 👤 Hajime Murakami

Bibliographic Details