Integrated circuit device

Abstract

Abstract PURPOSE:To prevent the bending and the like of an outer lead terminal, by bending the lead terminal of an integrated circuit in the inside of a mold, and taking out the terminal from the lower part of the mold. CONSTITUTION:A pellet 9, which is mounted on a lead frame 10, is connected to an outer lead terminal 7 by a metal wire 8 such as a gold wire. Bending machining of the outer lead terminal 7 is performed in the inside of a mold 6. The lead terminal is taken out of the lower part of the mold 6. The lead terminal 7, which is taken out in this way, is extremely strong against deformation such as bending. The positioning accuracy of the lead terminal is improved in comparison with a conventional lead-terminal taking out method.

Inventors

• 👤 Mamoru Sato
• 👤 護 佐藤

Bibliographic Details