Package for semiconductor device

Abstract

Abstract PURPOSE:To obtain a semiconductor device having excellent radiation resisting property and high sealing reliability, by using Cu-W alloy including W at a specified rate as a tightly sealing material for a ceramic package. CONSTITUTION:A Cu-W alloy material 3 including 80-95wt% W is bonded to the lower surface of a ceramic package 2. The thickness of a central part 6 of the Cu-W material 3, where a semiconductor element is located, is made thick. The semiconductor element 1 is directly mounted on said Cu-W matalloy material. The Cu-W alloy material 3 is also bonded to the upper surface of the mounted semiconductor element 1. By the Cu-W alloy material layer, radiation to the semiconductor element from the outside is shielded. Even for the semiconductor having a large amount of heating, heat radiation can be performed excellently.

Inventors

• 👤 Nobuo Ogasa
• 👤 小笠　伸夫
• 👤 Kazuhito Murakami
• 👤 村上　一仁
• 👤 Akira Otsuka
• 👤 昭 大塚

Bibliographic Details