Resin sealed type semiconductor integrated circuit

Abstract

Abstract PURPOSE:To prevent the leakage of ultraviolet rays from the lateral direction, and to hold informations stably by sealing only the upper section of a semiconductor die with a transparent resin, through which beams can pass, and sealing the periphery of the upper section of the semiconductor die with a resin, through which beams are not transmitted. CONSTITUTION:A semiconductor die 2 for an ultraviolet erasing type erasable and writable semiconductor memory storage is die-bonded onto a lead frame 1. Wires 3 are bonded with the semiconductor die 2. A section in the vicinity of the die 2 is coated with a transparent epoxy resin 4, through which ultraviolet rays can be transmitted. Other sections are coated with an epoxy resin 5, through which ultraviolet rays into which carbon black is mixed are not transmitted, while leaving a section, through which beams are transmitted, in the upper section of the die 2.

Inventors

• 👤 Hitoshi Yokoyama
• 👤 横山　均

Bibliographic Details