Semiconductor device

Abstract

Abstract PURPOSE:To improve the connecting strength and the reliability by providing a plurality of connecting points of internal wirings with a lead terminal in a package substrate. CONSTITUTION:A package substrate 1 is composed of a multilayer wiring ceramic substrate, a semiconductor chip 3 is contained in a cavity 2, and connected by wirings 5 with a terminal 4. Internal wirings 8, 11 are formed of W-metallized layer, and the internal wirings 9 are formed of through hole wirings of W-metallized layer. The end of the wirings 9 is connected with the W-metallized layer 10 on the bottom of the substrate 1 to connect the wirings 11 with the W-metallized layer 12 of the side of the substrate 1, a lead terminal 7 is bonded through Ni-plating film 13 and an Au-plating film 14, an Ni-plating film 15 and an Au-plating film 16 are again superposed, and coated to complete it.

Inventors

• 👤 Hisashi Komabayashi
• 👤 駒林　久士
• 👤 Toshiaki Ono
• 👤 俊昭 小野
• 👤 Toru Ishida
• 👤 徹 石田
• 👤 Tamotsu Arai
• 👤 荒井　保

Bibliographic Details