Solid-state image pickup device

Abstract

Abstract PURPOSE:To attain a solid-state image pickup device with inexpensive material cost and simple structure by bonding a glass filter to a semiconductor image pickup element, sealing incorporatedly a resin to the bonded element so that the upper face of the glass filter is exposed and the exposed face is formed directly to a photodetector section. CONSTITUTION:First the image pickup element 2 is fixed onto a lead frame 8 via silver paste resin and external leads 9 arranged radially are bonded by a metallic fine wire 3. Then a color filter 6 is adhered to the image pickup element 2 via an adhesives and after the adhesives is cured, the incorporated bonded body between the image pickup element 2 and the color filter 6 is sealed by the resin so that the upper face of the color filter 6 is exposed. Finally, the sealing resin detoured to the exposed face of the color filter 6 is polished by grinding particles with very fine grain (e.g., No. 10,000-15,000) to smooth the photodetecting section.

Inventors

• 👤 Hiroshi Okubo
• 👤 博 大久保

Bibliographic Details