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JPS61214531A Expired / Lapsed JP ⏱️ 0.0 years remaining

Wedge and wire bonder using wedge

Assignee: Hitachi Ltd
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Filing: 1985-03-20
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Granted: —
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Expires: 2005-03-20
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Abstract

Abstract PURPOSE:To prevent a protective film from being broken down in case of coming into contact with a pellet face by means of rounding the bonding side corner ends of a wedge. CONSTITUTION:The corners 4a-4d of a wedge 1 in the directions of width and thickness of bonding ends are rounded so that a protective film may not be broken down due to the contact between an end of wedge 1 and a pallet face even if the pellet is inclined in case of linear bonding operation. When a wedge conforming to such a constitution is linear-bonded by ultrasonic vibration, the bonding yield may be improved remarkably since any breakdown of protective film due to the contact between an end of wedge in the width direction and a pellet face may be entirely avoided.

Inventors

  • 👤 Hideo Tanbara
  • 👤 丹原 日出夫
  • 👤 Hideaki Nakagome
  • 👤 英明 中込

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-05 07:15
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/07173; H10W72/075; H10W72/07502; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07551; H10W72/50; H10W72/531; H10W72/5363; H10W90/00; H10W90/701; H10W90/751; H10W90/756

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