Photocurable conductive coating composition

Abstract

Abstract PURPOSE:To provide the titled composition of high scratch resistance, electrical conductivity and transparency, ready to cure by ultraviolet rays, etc. for semiconductor wafer storage containers, etc., comprising (meth)acryloyl group-contg. (meth)acrylic oligomer, tin oxide and polyisoprene derivative. CONSTITUTION:The objective composition comprising (A) a coating binder consisting mainly of (meth)acrylic oligomer having at least two (meth)acryloyl groups, (B) pref. 5-80wt% (based on the whole composition) of conductive powder of a size <=0.2mum, consisting mainly of tin oxide, and (C) polyisoprene derivative derived from adding organic group of formula I [R is 1-20C hydrocarbon, alkylamino, of formula II (R' is alkyl), group having both unsaturated group and OH, group having unsaturated group, amino plus epoxy groups]. USE:For application to flooring, wall materials in electronic member manufacturing plants etc.

Inventors

• 👤 Kazuo Maejima
• 👤 前島　一夫
• 👤 Kunio Yanagisawa
• 👤 柳沢　邦夫
• 👤 Takahiro Mori
• 👤 隆弘 森

Bibliographic Details