Hybrid integrated circuit

Abstract

Abstract PURPOSE:To realize a highly reliable hybrid integrated circuit having high heat dissipating property by a method wherein insulating plates are adhered with a metal substrate at places, where the insulating plates have been fixed with elements having a large heat value, and leads fixed to a resin case are adhered to the edge end parts of the insulating plates. CONSTITUTION:A metal substrate 2 has press fit parts 2a and 2b made of aluminum and a resin case 3 consists of a side frame 3a made of polybutylene butanol resin and a metal cover plate 3b made of iron. Insulating plates 4a and 4b made of ceramics are respectively adhered onto the press fit parts 2a and 2b with silicone or epoxy bonding agents 5a and 5b and printing wirings 6a and 6b are provided on the upper surfaces of the insulating plates 4a and 4b. Circuit elements 7a and 7b such as thyristor, transistor, etc., having a large heat value, are fixed onto the insulating plates 4a and 4b at the parts of the plates, where correspond to just over the press fit parts 2a and 2b, and circuit elements such as resistor, capacitor, etc., having a small heat value, are fixed on the circumferences thereof as control circuit parts 8a and 8b. By this method, the heat dissipating proterty of the whole device is enhanced, thereby enabling to eliminate a thermal deformation and a crack.

Inventors

• 👤 Tatsuo Yamazaki
• 👤 山崎　龍雄
• 👤 Masatami Miura
• 👤 三浦　雅民
• 👤 Yoichi Nakajima
• 👤 中島　羊一
• 👤 Hirohiko Ikeda
• 👤 池田　裕彦

Bibliographic Details