Substrate for mounting semiconductor element

Abstract

Abstract PURPOSE:To enable to form a complicated circuit pattern by a method wherein the metal members of circuit patterns are bonded to the titled substrate made of a non-metal refractory material utilizing an eutectic and two kinds of pattern parts of a first pattern part of a thickness of less than 0.5mm. and a second pattern part of a thickness of 20-50mum and a width of less than 2mm. are made to contain in the circuit pattern on at least one side of the circuit patterns. CONSTITUTION:At least two kinds of pattern parts, which are respectively different in pattern width, are made to contain in a circuit pattern on at least one side out of circuit patterns 21 and 22, the surface circuit 21, for example. Namely, a first pattern part P'1 suitable for a large current part is made to bond its 0.2-0.3mm. thick steel plate to a substrate 20 made of a non-metal refractory material. A second pattern part P'2 suitable for a small current part is finely formed in a thickness of 20-50mum and a width of 0.3-1.0mm.. At the same time when the circuit patterns are formed in such a way, thick-film circuit parts such as a resistor, a capacitor, etc., are formed. As a result, a hybrid circuit is formed.

Inventors

• 👤 Masaru Ando
• 👤 勝 安藤

Bibliographic Details