Resin sealed type semiconductor device

Abstract

Abstract PURPOSE:To improve the moisture proofing reliability by a method wherein thickness of a part starting from a point 0.2mm. or more inside the resin surface of an internal lead to a point as the ending point of bending external lead is reduced by 1/3 down to 2/3 thickness of the other parts. CONSTITUTION:The thickness of a part 8 starting from a point 0.2mm. inside the surface (a) of a resin 4 of a lead 7 to a point as the ending point of bending external lead is reduced by 1/3 down to 2/3 thickness of the other parts. In such a constitution, the moisture proofing reliability may be improved remarkably since the external lead bending force may be reduced diminishing the stress on the resin and preventing any chipping and cracking at a resin part (b) from happening. On the other hand, the drawing strength of the lead may be increased.

Inventors

• 👤 Yasuhisa Kobayashi
• 👤 小林　安久
• 👤 Takashi Kinoshita
• 👤 高志 木下

Bibliographic Details