Resin molded ic package

Abstract

Abstract PURPOSE:To ease the distortion of a die lead frame due to a thermal expansion by a method wherein an IC chip and the die lead frame are bonded with a thermoplastic resin, and at the same time, the bonding area is made smaller than the base area of the chip. CONSTITUTION:In a resin molded package, an IC chip 2 and a die lead frame 3 are bonded by using a thermoplatic resin as a die bonding member 7. The bonding area of the base of the IC chip 2 to the die lead frame 3 is limited to a smaller area than the base area of the IC chip 2 and ring-shaped gaps 8 are formed on the periphery of the bonding member 7. Accordingly, even though the lead frame 3 is caused a distortion due to a thermal expansion, the distortion is absorbed and eased by the thermoplastic resin and no deforming stress effects on the IC chip 2.

Inventors

• 👤 Shigeru Sasaki
• 👤 繁 佐々木
• 👤 Koji Serizawa
• 👤 弘二 芹沢
• 👤 Kazuo Shimizu
• 👤 一男 清水

Bibliographic Details