Semiconductor device

Abstract

Abstract PURPOSE:To improve moisture resistance around a pellet in order to prevent wire disconnection by bonding paste to a tab in the region within an area of th surface for bonding the pellet. CONSTITUTION:Liquid Ag paste 3 is applied on a tab 2 of a lead frame 1 in such a manner that said paste does not projected largely from the area of a lower face 4A of a pellet 4 and exists in the region of the practically same area as that of the lower face 4A. Thus, gas produced when the paste 3 is heated and hardened does not stick to the side surfaces 4B and 4C of the pellet 4, so that the bonding between resin 6, and the side surface 4B and the upper surface 4C is kept in a good state.

Inventors

• 👤 Susumu Okikawa
• 👤 Hiroshi Mikino

Bibliographic Details