Semiconductor device

Assignee: Hitachi Ltd

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Filing: 1980-10-24

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Granted: —

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Expires: 2000-10-24

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Abstract

Abstract PURPOSE:To improve moisture resistance around a pellet in order to prevent wire disconnection by bonding paste to a tab in the region within an area of th surface for bonding the pellet. CONSTITUTION:Liquid Ag paste 3 is applied on a tab 2 of a lead frame 1 in such a manner that said paste does not projected largely from the area of a lower face 4A of a pellet 4 and exists in the region of the practically same area as that of the lower face 4A. Thus, gas produced when the paste 3 is heated and hardened does not stick to the side surfaces 4B and 4C of the pellet 4, so that the bonding between resin 6, and the side surface 4B and the upper surface 4C is kept in a good state.

Inventors

👤 Susumu Okikawa
👤 Hiroshi Mikino

Bibliographic Details

Application Number —

Jurisdiction JP

Data Source google_patents

Last Synchronized 2026-11-03 22:18

CPC Classifications

H; H10; H10W; H10W20/00; H10W20/40; H10W70/00; H10W70/40; H10W70/411; H10W70/417; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/075; H10W72/07551; H10W72/30; H10W72/321; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756

Claims Analysis

Total Claims: 0

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References Cited (Backward Citations)

JPS5237455B2 Cited

JPS54109770A Cited

JPS55130134A Cited

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