Semiconductor light-emitting device

Abstract

Abstract PURPOSE:To prevent a conductive bonding agent from outflowing to refractive surfaces when the title light-emitting element is mounted by a method wherein a rise part having a vertical face is respectively provided between the mounting face and the refractive surfaces. CONSTITUTION:A rise part 16 having a vertical face is respectively provided between a mounting face 12 and refractive surfaces 15a. Therefore, even though a solder is kept liquefied at a high temperature when an LED pellet 14 is adhered, the soldering paste, which tries to outflow from the mounting face 12, is obstructed to outflow by the rise parts 16 and is not allowed to creep up along the refractive surfaces 15a. Accordingly, there is no possibility that the refractive surfaces 15a are soiled, thereby enabling to prevent it for the reflection efficiency of the title device to decrease.

Inventors

• 👤 Senya Kita
• 👤 北　仙也

Bibliographic Details