Semiconductor device

Abstract

Abstract PURPOSE:To obtain high mechanical strength for the title semiconductor device by a method wherein an element terminal, an inner lead terminal and an outer lead are connected and formed in one body through the intermediary of a dam part. CONSTITUTION:Four outer leads 2 are led out from the side part of a resin- sealed body 1. Two of the four leads 2 are connected to an inner lead terminal 5 through a dam part 4. The remaining two leads are connected to an element terminal 6 through the intermediary of the dam part 4. A widely-formed element mounting part 7 having heat dissipating function is formed at the tip part of the terminal 6. A prescribed element 9 is installed at the mounting part 7 through the intermediary of a solder layer 8. A connector lead 10 is installed on the element 9, located on the mounting part 7, and a terminal 5 through the intermediary of the solder layer 8.

Inventors

• 👤 Yoshimasa Kudo
• 👤 工藤　好正

Bibliographic Details