Washing device for semiconductor wafer

Abstract

Abstract PURPOSE:To effectively remove organic contaminant deposited on the surface of a wafer by a method wherein the title device is composed of a washing bath in which a washing chemical solution is contained, a hold carrier for semiconductor wafers dipped therein, an ultrasonic wave generator that gives oscillation, an irradiator with ultraviolet rays to wafers, etc. CONSTITUTION:The wafer carrier 2 holding the semiconductor wafers 1 to be washed is contained in the wafer washing bath 3 made of transparent quartz surrounded by a casing 13, and many ultraviolet ray lamps 9 are arranged in the gap between the carrier 2 and the bath 3. Chemical solution supply ports 4-7 are made opposed to the upper surface of the bath 3, and the ultrasonic wave generator 10 surrounding a valve 11 and a duct is installed outside the bottom. The device being thus constructed, hydrofluoric acid, hydrogen peroxide, hydrochloric acid, aqueous ammonia, persulfuric acid, etc. are poured from the supply ports 4-7, respectively; at the same time the bath 3 is filled with the chemical solution 8 obtained by feed of pure water from the duct 12. Thereafter, the lamps 9 and the generator 10 are set in motion at the same time, and the deposited organic substance is thus removed.

Inventors

• 👤 Shintaro Yoshii
• 👤 吉井　新太郎

Bibliographic Details