Heat dissipating device for electronic part

Abstract

Abstract PURPOSE:To improve cooling efficiency and workability of mounting, by providing a heat dissipating member comprising a good heat conductive metal and a heat conductive elastomer, which is formed so that it is contacted with the most part of the heat dissipating surface of an electronic part and the heat dissipating member. CONSTITUTION:A heat dissipating fin 3 comprising a heat conducting metal is formed so as to cover the most part of an IC chip 6. A heat conductive elastomer is formed so that it is contacted with the most part of the IC chip 6 and the heat dissipating fin 3. Since the heat conductive elastomer 9 is uniformly and closely contacted with the heat dissipating fin 3 and the heat dissipating part of the IC chip 6 in this way, heat resistance between the heat dissipating fin 3 and the IC chip 6 becomes small, and the cooling efficiency is improved.

Inventors

• 👤 Takahiko Watanabe
• 👤 渡辺　隆比古
• 👤 Kiyoshi Hani
• 👤 羽仁　潔
• 👤 Takako Takei
• 👤 竹井　多賀子
• 👤 Kiyoshi Nojima
• 👤 野島　清

Bibliographic Details