Cooling device for electronic parts

Abstract

Abstract PURPOSE:To improve cooling efficiency and workability of mounting, by using a heat conducting bonding agent for a heat dissipating member, bonding heat conductive elastomers, and closely contacting the elastomers to the heat dissipating surfaces of electronic parts. CONSTITUTION:Hardened materials of heat conductive elastomers 7 are formed into a specified shape. The heat conductive elastomers 7 are stuck to the specified positions of a heat dissipator 6 and a printed board 2 by a screen printing method. Then a bonding agent is completely harded. Thereafter, electronic parts such as IC chips 1 are mounted, and the heat dissipater 6 is fixed to a cabinet and the like. Under this state, the heat conductive elastomers 7 are closely contacted with the heat radiator 6 or the printed board 2 by a heat conductive bonding agent 8. Owing to the deformation at the time of mounting, the elastomers are closely contacted with all the surfaces of the electronic parts such as the IC chips 1. Thus a heat conducting path, whose contact heat resistance is very small is formed.

Inventors

• 👤 Takahiko Watanabe
• 👤 渡辺　隆比古
• 👤 Kiyoshi Hani
• 👤 羽仁　潔
• 👤 Takako Takei
• 👤 竹井　多賀子
• 👤 Kiyoshi Nojima
• 👤 野島　清

Bibliographic Details